Molex Launches Impress Co-Packaged Copper Solutions, Scaling Near-ASIC Connectivity Innovations to Meet Next-Generation Data Rate Demands
PR Newswire —
Compression-based, on-substrate connector and cable assembly optimize signal integrity and efficient power distribution at speeds of 224Gbps PAM-4 and beyond Impress leverages insights and engineering expertise from NearStack OTS, with over one million units delivered to date Compact...