Hyundai Mobis and Qualcomm Sign Comprehensive Agreement to Collaborate on SDV architecture for ADAS
PR Newswire —
MOU signed at CES 2026 to co-develop integrated solutions for automotive tailored to emerging markets Hyundai Mobis to enhance performance, efficiency, and stability for advanced driver assistance systems using Qualcomm's Snapdragon RideTM Flex system-on-chip Companies' agreement extends...