NovoLINC Raises New Capital to Break the Thermal Barrier Limiting Next-Gen AI Chips
PR Newswire —
PITTSBURGH, Dec. 18, 2025 /PRNewswire/ -- NovoLINC, a leader in advanced thermal interface material (TIM) solutions for high-performance computing, today announced the closing of an oversubscribed funding round to accelerate the commercialization of its breakthrough technology. The round...